NAND02GW3B3AN1F vs NAND02GW3B2BN1 feature comparison

NAND02GW3B3AN1F STMicroelectronics

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NAND02GW3B2BN1 STMicroelectronics

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code TSOP TSOP
Package Description TSOP1, TSSOP48,.8,20 TSOP1,
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 35 ns 35 ns
Command User Interface YES
Data Polling NO
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e3/e6 e0
Length 18.4 mm 18.4 mm
Memory Density 2147483648 bit 2147483648 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Sectors/Size 2K
Number of Terminals 48 48
Number of Words 268435456 words 268435456 words
Number of Words Code 256000000 256000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256MX8 256MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Page Size 2K words
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm 1.2 mm
Sector Size 128K
Standby Current-Max 0.00005 A
Supply Current-Max 0.02 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN/TIN BISMUTH TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Toggle Bit NO
Width 12 mm 12 mm
Base Number Matches 1 4

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