NAND01GW4A3BN6T vs S29GL064N90TFI30 feature comparison

NAND01GW4A3BN6T STMicroelectronics

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S29GL064N90TFI30 Spansion

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer STMICROELECTRONICS SPANSION INC
Part Package Code TSOP TSOP1
Package Description TSOP1, LEAD FREE, MO-142EC, TSOP-48
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 12000 ns 90 ns
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0 e3
Length 18.4 mm 18.4 mm
Memory Density 1073741824 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 67108864 words 4194304 words
Number of Words Code 64000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 12 mm 12 mm
Base Number Matches 1 1
Category CO2 Kg 12
Compliance Temperature Grade Industrial: -40C to +85C
EU RoHS Version RoHS 2 (2011/65/EU)
Candidate List Date 2014-06-16
EFUP e
Conflict Mineral Status DRC Conflict Free
Conflict Mineral Status Source CMRT V3.02
Alternate Memory Width 8
Moisture Sensitivity Level 3

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