NAND01GR4A0BN1T
vs
NAND01GR4B2CN6T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NUMONYX
MICRON TECHNOLOGY INC
Part Package Code
TSOP
TSOP
Package Description
TSOP1,
TSSOP,
Pin Count
48
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
35 ns
35 ns
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
Length
18.4 mm
18.4 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
64MX16
64MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
1.8 V
1.8 V
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Current-Max
0.015 mA
0.015 mA
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
SLC NAND TYPE
NAND TYPE
Width
12 mm
12 mm
Base Number Matches
1
1
Category CO2 Kg
12
Compliance Temperature Grade
Industrial: -40C to +85C
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