N82S226F vs MB7114LP feature comparison

N82S226F Philips Semiconductors

Buy Now Datasheet

MB7114LP FUJITSU Semiconductor Limited

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP FUJITSU SEMICONDUCTOR AMERICA INC
Package Description , DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
JESD-30 Code R-GDIP-T16 R-PDIP-T16
Memory Density 1024 bit 1024 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min
Organization 256X4 256X4
Output Characteristics OPEN-COLLECTOR 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 2
I/O Type COMMON
Length 19.35 mm
Package Code DIP
Package Equivalence Code DIP16,.3
Programming Voltage 5 V
Seated Height-Max 4.65 mm
Supply Current-Max 0.04 mA
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare N82S226F with alternatives

Compare MB7114LP with alternatives