N82S147AN vs AM27S29/BRA feature comparison

N82S147AN NXP Semiconductors

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AM27S29/BRA AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP20,.3
Pin Count 20 20
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 45 ns 70 ns
JESD-30 Code R-PDIP-T20 R-GDIP-T20
Memory Density 4096 bit 4096 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 512X8 512X8
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 1
Rohs Code No
JESD-609 Code e0
Length 24.257 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP20,.3
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Supply Current-Max 0.16 mA
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare N82S147AN with alternatives

Compare AM27S29/BRA with alternatives