N82S09AN vs N82S09I feature comparison

N82S09AN YAGEO Corporation

Buy Now Datasheet

N82S09I NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS SIGNETICS CORP
Package Description , DIP, DIP28,.6
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 45 ns
JESD-30 Code R-PDIP-T28 R-GDIP-T28
Memory Density 576 bit 576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 9 9
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 28 28
Number of Words 64 words 64 words
Number of Words Code 64 64
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min
Organization 64X9 64X9
Output Characteristics OPEN-COLLECTOR OPEN-COLLECTOR
Output Enable NO NO
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP28,.6
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm

Compare N82S09AN with alternatives

Compare N82S09I with alternatives