N8200F vs N8200Q feature comparison

N8200F Philips Semiconductors

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N8200Q NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS SIGNETICS CORP
Package Description DIP, DIP24,.6 ,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T24 R-CDFP-F24
JESD-609 Code e0
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Functions 10 2
Number of Terminals 24 24
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min
Package Body Material CERAMIC CERAMIC, METAL-SEALED COFIRED
Package Code DIP DFP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE NEGATIVE EDGE
Base Number Matches 3 3
Family 82
Load Capacitance (CL) 18 pF
Number of Bits 5
Output Polarity TRUE
Power Supply Current-Max (ICC) 110 mA
Propagation Delay (tpd) 45 ns
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V

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