N80387SX-16
vs
TS68882MF8B/Y16
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
THOMSON-CSF SEMICONDUCTORS
|
| Part Package Code |
LCC
|
QFP
|
| Package Description |
QCCJ, LDCC68,1.0SQ
|
,
|
| Pin Count |
68
|
68
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A001.A.2.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
|
| Boundary Scan |
NO
|
|
| Bus Compatibility |
INTEL386SX
|
|
| Clock Frequency-Max |
50 MHz
|
|
| External Data Bus Width |
16
|
|
| JESD-30 Code |
S-PQCC-J68
|
S-CQFP-G68
|
| JESD-609 Code |
e0
|
|
| Length |
24.2 mm
|
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
100 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCJ
|
|
| Package Equivalence Code |
LDCC68,1.0SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.83 mm
|
|
| Supply Current-Max |
240 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CHMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24.2 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, COPROCESSOR
|
MATH PROCESSOR, COPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Screening Level |
|
CECC90000B
|
|
|
|
Compare N80387SX-16 with alternatives
Compare TS68882MF8B/Y16 with alternatives