N74LV138PW vs CD74HCT237M feature comparison

N74LV138PW NXP Semiconductors

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CD74HCT237M Harris Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS HARRIS SEMICONDUCTOR
Package Description TSSOP, SOP, SOP16,.25
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family LV/LV-A/LVX/H HCT
Input Conditioning STANDARD LATCHED
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity INVERTED TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Propagation Delay (tpd) 26 ns 48 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 4.4 mm
Base Number Matches 4 2
Rohs Code No
Additional Feature ADDRESS LATCHES
JESD-609 Code e0
Max I(ol) 0.004 A
Package Equivalence Code SOP16,.25
Prop. Delay@Nom-Sup 57 ns
Terminal Finish TIN LEAD

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Compare CD74HCT237M with alternatives