N74LS253B vs HD74LS253P-E feature comparison

N74LS253B Philips Semiconductors

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HD74LS253P-E Renesas Electronics Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP RENESAS ELECTRONICS CORP
Package Description , DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-PDIP-T16 R-PDIP-T16
Load Capacitance (CL) 15 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 2 2
Number of Inputs 4 4
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min -20 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 12 mA
Propagation Delay (tpd) 32 ns 25 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 1
Part Package Code DIP
Pin Count 16
Length 19.2 mm
Seated Height-Max 5.06 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

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