N74LS21N
vs
JM38510/31003BCA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
PHILIPS COMPONENTS
NATIONAL SEMICONDUCTOR CORP
Package Description
,
CERAMIC, DIP-14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
Load Capacitance (CL)
15 pF
Logic IC Type
AND GATE
AND GATE
Number of Functions
2
2
Number of Inputs
4
4
Number of Terminals
14
14
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
4.4 mA
Propagation Delay (tpd)
20 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
4
2
JESD-609 Code
e0
Length
19.56 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
MIL-PRF-38535 Class B
Seated Height-Max
5.08 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Compare N74LS21N with alternatives
Compare JM38510/31003BCA with alternatives