N74H00F
vs
MC74ACT132DR2G
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ROCHESTER ELECTRONICS LLC
Package Description
DIP, DIP14,.3
LEAD FREE, SOIC-14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
TTL/H/L
ACT
JESD-30 Code
R-GDIP-T14
R-PDSO-G14
JESD-609 Code
e0
e3
Load Capacitance (CL)
25 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.02 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Power Supply Current-Max (ICC)
40 mA
Prop. Delay@Nom-Sup
10 ns
Propagation Delay (tpd)
10 ns
13 ns
Qualification Status
Not Qualified
COMMERCIAL
Schmitt Trigger
NO
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Pbfree Code
Part Package Code
SOIC
Pin Count
14
Length
8.65 mm
Moisture Sensitivity Level
NOT SPECIFIED
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.75 mm
Time@Peak Reflow Temperature-Max (s)
40
Width
3.9 mm
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