N74H00F
vs
74ACTQ00SCQR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FAIRCHILD SEMICONDUCTOR CORP
Package Description
DIP, DIP14,.3
SOP, SOP14,.25
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
TTL/H/L
JESD-30 Code
R-GDIP-T14
R-PDSO-G14
JESD-609 Code
e0
e0
Load Capacitance (CL)
25 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.02 A
0.024 A
Number of Functions
4
Number of Inputs
2
Number of Terminals
14
14
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP14,.3
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Power Supply Current-Max (ICC)
40 mA
Prop. Delay@Nom-Sup
10 ns
8 ns
Propagation Delay (tpd)
10 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
NO
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Rohs Code
No
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