N74F827D
vs
54ACTQ827LMX
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
Package Description
SOP, SOP24,.4
QCCN,
Pin Count
24
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
WITH DUAL OUTPUT ENABLE
WITH DUAL OUTPUT ENABLE
Control Type
ENABLE LOW
Family
F/FAST
ACT
JESD-30 Code
R-PDSO-G24
S-CQCC-N28
JESD-609 Code
e4
Length
15.4 mm
11.43 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.064 A
Moisture Sensitivity Level
1
Number of Bits
10
10
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
24
28
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
QCCN
Package Equivalence Code
SOP24,.4
LCC28,.45SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
CHIP CARRIER
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
100 mA
Prop. Delay@Nom-Sup
18 ns
Propagation Delay (tpd)
14 ns
9 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
1.905 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
7.5 mm
11.43 mm
Base Number Matches
8
1
Compare N74F827D with alternatives
Compare 54ACTQ827LMX with alternatives