N54F776/BYA
vs
54F776/BXA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DFP
DIP
Package Description
DFP,
DIP,
Pin Count
28
28
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
COMPATIBLE PI-BUS & IEEE 896 FUTUREBUS STANDARDS; BTL PORT OPEN COLLECTOR OUTPUTS
COMPATIBLE PI-BUS & IEEE 896 FUTUREBUS STANDARDS; BTL PORT OPEN COLLECTOR OUTPUTS
Family
F/FAST
F/FAST
JESD-30 Code
R-XDFP-F28
R-GDIP-T28
Load Capacitance (CL)
30 pF
30 pF
Logic IC Type
REGISTERED BUS TRANSCEIVER
REGISTERED BUS TRANSCEIVER
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
28
28
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
OPEN-COLLECTOR/3-STATE
OPEN-COLLECTOR/3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
DFP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Power Supply Current-Max (ICC)
145 mA
145 mA
Propagation Delay (tpd)
9.5 ns
9.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.286 mm
5.8928 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
9.144 mm
15.24 mm
Base Number Matches
1
3
Compare N54F776/BYA with alternatives
Compare 54F776/BXA with alternatives