54F776/BXA vs 74F776A feature comparison

54F776/BXA NXP Semiconductors

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74F776A YAGEO Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS COMPONENTS
Part Package Code DIP
Package Description DIP, ,
Pin Count 28
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature COMPATIBLE PI-BUS & IEEE 896 FUTUREBUS STANDARDS; BTL PORT OPEN COLLECTOR OUTPUTS WITH DESIGNATED TTL AND BTL PORTS; COMPATIBLE WITH PI-BUS & IEEE 896 FUTUREBUS STANDARDS
Family F/FAST F/FAST
JESD-30 Code R-GDIP-T28 R-PDSO-J28
Load Capacitance (CL) 30 pF 30 pF
Logic IC Type REGISTERED BUS TRANSCEIVER REGISTERED BUS TRANSCEIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 28 28
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Characteristics OPEN-COLLECTOR/3-STATE OPEN-COLLECTOR/3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOJ
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Power Supply Current-Max (ICC) 145 mA 145 mA
Propagation Delay (tpd) 9.5 ns 9.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.8928 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 3 1

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