N256S0818HDAS2-20I
vs
CY14B256Q1-LHXI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ON SEMICONDUCTOR
CYPRESS SEMICONDUCTOR CORP
Part Package Code
SOIC
DFN
Package Description
SOP,
0.300 INCH, ROHS COMPLIANT, MO-240, DFN-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
JESD-30 Code
R-PDSO-G8
R-PDSO-N8
Length
4.9 mm
6 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
NON-VOLATILE SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32KX8
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
HVSON
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
0.8 mm
Supply Voltage-Max (Vsup)
1.95 V
3.6 V
Supply Voltage-Min (Vsup)
1.7 V
2.7 V
Supply Voltage-Nom (Vsup)
1.8 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.91 mm
5 mm
Base Number Matches
2
1
Rohs Code
Package Equivalence Code
SOLCC8,.25
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Standby Current-Max
0.005 A
Supply Current-Max
0.01 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare N256S0818HDAS2-20I with alternatives
Compare CY14B256Q1-LHXI with alternatives