MXL1013IN8+
vs
LMC6482AIN/NOPB
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
0.300 INCH, PLASTIC, MS-001AB, DIP-8
PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
unknown
compliant
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB)
0.038 µA
0.000004 µA
Common-mode Reject Ratio-Nom
113 dB
82 dB
Input Offset Voltage-Max
1000 µV
750 µV
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
9.375 mm
9.817 mm
Moisture Sensitivity Level
1
1
Neg Supply Voltage Limit-Max
-22 V
Neg Supply Voltage-Nom (Vsup)
-15 V
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
4.572 mm
5.08 mm
Slew Rate-Nom
0.4 V/us
1.3 V/us
Supply Voltage Limit-Max
22 V
16 V
Supply Voltage-Nom (Vsup)
15 V
5 V
Surface Mount
NO
NO
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Width
7.62 mm
7.62 mm
Base Number Matches
2
2
ECCN Code
EAR99
HTS Code
8542.33.00.01
Architecture
VOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min
67 dB
Frequency Compensation
YES
Low-Bias
YES
Low-Offset
NO
Micropower
YES
Package Equivalence Code
DIP8,.3
Packing Method
RAIL
Slew Rate-Min
0.7 V/us
Supply Current-Max
1.9 mA
Technology
CMOS
Unity Gain BW-Nom
1500
Voltage Gain-Min
13000
Compare MXL1013IN8+ with alternatives
Compare LMC6482AIN/NOPB with alternatives