MXL1013IN8+ vs LMC6482AIN/NOPB feature comparison

MXL1013IN8+ Rochester Electronics LLC

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LMC6482AIN/NOPB National Semiconductor Corporation

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description 0.300 INCH, PLASTIC, MS-001AB, DIP-8 PLASTIC, DIP-8
Pin Count 8 8
Reach Compliance Code unknown compliant
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.038 µA 0.000004 µA
Common-mode Reject Ratio-Nom 113 dB 82 dB
Input Offset Voltage-Max 1000 µV 750 µV
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e3 e3
Length 9.375 mm 9.817 mm
Moisture Sensitivity Level 1 1
Neg Supply Voltage Limit-Max -22 V
Neg Supply Voltage-Nom (Vsup) -15 V
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 260 260
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 4.572 mm 5.08 mm
Slew Rate-Nom 0.4 V/us 1.3 V/us
Supply Voltage Limit-Max 22 V 16 V
Supply Voltage-Nom (Vsup) 15 V 5 V
Surface Mount NO NO
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN Matte Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
ECCN Code EAR99
HTS Code 8542.33.00.01
Architecture VOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min 67 dB
Frequency Compensation YES
Low-Bias YES
Low-Offset NO
Micropower YES
Package Equivalence Code DIP8,.3
Packing Method RAIL
Slew Rate-Min 0.7 V/us
Supply Current-Max 1.9 mA
Technology CMOS
Unity Gain BW-Nom 1500
Voltage Gain-Min 13000

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