MX7547JEWG+T
vs
AD7547JP
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Part Package Code |
24-SOIC_W-300_MIL
|
|
| Pin Count |
24
|
28
|
| Manufacturer Package Code |
24-SOIC_W-300_MIL
|
|
| Date Of Intro |
1999-05-28
|
|
| Analog Output Voltage-Max |
10 V
|
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY, OFFSET BINARY, 2S COMPLEMENT BINARY
|
BINARY
|
| Input Format |
PARALLEL, WORD
|
|
| JESD-30 Code |
R-PDSO-G24
|
S-PQCC-J28
|
| JESD-609 Code |
e3
|
e0
|
| Length |
15.4 mm
|
|
| Linearity Error-Max (EL) |
0.0244%
|
0.024%
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
12
|
12
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
24
|
28
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
QCCJ
|
| Package Equivalence Code |
SOP24,.4
|
LDCC28,.5SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
|
| Settling Time-Max |
1.5 µs
|
1.5 µs
|
| Settling Time-Nom (tstl) |
0.8 µs
|
|
| Supply Current-Max |
2 mA
|
2 mA
|
| Supply Voltage-Nom |
15 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7.5 mm
|
|
| Base Number Matches |
2
|
3
|
| Ihs Manufacturer |
|
MAXIM INTEGRATED PRODUCTS INC
|
| Reach Compliance Code |
|
not_compliant
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
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