MX7506JQ vs HI4-0507-8 feature comparison

MX7506JQ Maxim Integrated Products

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HI4-0507-8 Intersil Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC INTERSIL CORP
Part Package Code DIP
Package Description 0.600 INCH, CERAMIC, DIP-28
Pin Count 28
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature HTTP://PDFSERV.MAXIM-IC.COM/PACKAGE_DWGS/21-0046.PDF
Analog IC - Other Type SINGLE-ENDED MULTIPLEXER DIFFERENTIAL MULTIPLEXER
JESD-30 Code R-GDIP-T28 S-XQCC-N28
JESD-609 Code e0 e0
Moisture Sensitivity Level 1
Neg Supply Voltage-Max (Vsup) -18 V
Neg Supply Voltage-Min (Vsup) -4.5 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Channels 16 8
Number of Functions 1 1
Number of Terminals 28 28
Off-state Isolation-Nom 70 dB
On-state Resistance Match-Nom 12 Ω
On-state Resistance-Max (Ron) 450 Ω 400 Ω
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -25 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP QCCN
Package Equivalence Code DIP28,.6 LCC28,.45SQ
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.89 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO YES
Switch-off Time-Max 1000 ns
Switch-on Time-Max 1000 ns 500 ns
Switching BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade OTHER MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 15.24 mm
Base Number Matches 1 2
Screening Level MIL-STD-883 Class B (Modified)
Signal Current-Max 0.02 A
Supply Current-Max (Isup) 3 mA

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