MX574ALP+T
vs
HS574AB/LCC
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
SATCON ELECTRONICS
|
| Part Package Code |
QLCC
|
QLCC
|
| Package Description |
QCCJ,
|
QCCN,
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
10 V
|
16.5 V
|
| Analog Input Voltage-Min |
-10 V
|
-16.5 V
|
| Conversion Time-Max |
25 µs
|
25 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
S-PQCC-J28
|
S-CQCC-N28
|
| JESD-609 Code |
e3
|
|
| Length |
11.505 mm
|
11.43 mm
|
| Linearity Error-Max (EL) |
0.012%
|
0.012%
|
| Moisture Sensitivity Level |
1
|
|
| Negative Supply Voltage-Nom |
-15 V
|
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Bit Code |
BINARY, OFFSET BINARY
|
BINARY, OFFSET BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCJ
|
QCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
2.29 mm
|
| Supply Voltage-Nom |
15 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
J BEND
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
11.505 mm
|
11.43 mm
|
| Base Number Matches |
1
|
3
|
| Package Equivalence Code |
|
LCC28,.45SQ
|
|
|
|
Compare MX574ALP+T with alternatives
Compare HS574AB/LCC with alternatives