HS574AB/LCC
vs
ADC-HX12BMM
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
SATCON ELECTRONICS
|
C&D TECHNOLOGIES INC
|
| Part Package Code |
QLCC
|
DIP
|
| Package Description |
QCCN,
|
DIP, DIP32,.9
|
| Pin Count |
28
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
16.5 V
|
10 V
|
| Analog Input Voltage-Min |
-16.5 V
|
-10 V
|
| Conversion Time-Max |
25 µs
|
20 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
S-CQCC-N28
|
R-CDIP-T32
|
| Length |
11.43 mm
|
|
| Linearity Error-Max (EL) |
0.012%
|
0.0122%
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
32
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Bit Code |
BINARY, OFFSET BINARY
|
COMPLEMENTARY BINARY, COMPLEMENTARY 2'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY
|
| Output Format |
PARALLEL, WORD
|
SERIAL, PARALLEL, WORD
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCN
|
DIP
|
| Package Equivalence Code |
LCC28,.45SQ
|
DIP32,.9
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.29 mm
|
5.969 mm
|
| Supply Voltage-Nom |
15 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
11.43 mm
|
22.86 mm
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
No
|
| ECCN Code |
|
3A001.A.2.C
|
| JESD-609 Code |
|
e4
|
| Negative Supply Voltage-Nom |
|
-15 V
|
| Technology |
|
HYBRID
|
| Terminal Finish |
|
GOLD
|
|
|
|
Compare HS574AB/LCC with alternatives
Compare ADC-HX12BMM with alternatives