MX52LM08A11XVI vs SDINBDG4-8G-I1T feature comparison

MX52LM08A11XVI Macronix International Co Ltd

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SDINBDG4-8G-I1T Western Digital Corp

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MACRONIX INTERNATIONAL CO LTD WESTERN DIGITAL CORP
Package Description TFBGA, BGA153,14X14,20 TFBGA-153
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 200 MHz 200 MHz
Command User Interface YES
Data Polling NO
JESD-30 Code R-PBGA-B153 R-PBGA-B153
Length 13 mm 13 mm
Memory Density 68719476736 bit 68719476736 bit
Memory IC Type FLASH CARD FLASH CARD
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 153 153
Number of Words 8589934592 words 8589934592 words
Number of Words Code 8000000000 8000000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -25 °C
Organization 8GX8 8GX8
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA153,14X14,20 BGA153,14X14,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3.3 V 3.3 V
Seated Height-Max 1 mm 0.8 mm
Supply Current-Max 0.045 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit NO
Type MLC NAND TYPE MLC NAND TYPE
Width 11.5 mm 11.5 mm
Base Number Matches 1 1
Data Retention Time-Min 1
Endurance 3000 Write/Erase Cycles
Moisture Sensitivity Level 3

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Compare SDINBDG4-8G-I1T with alternatives