MX52LM08A11XVI
vs
SDINBDG4-8G-XI
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MACRONIX INTERNATIONAL CO LTD
|
WESTERN DIGITAL CORP
|
| Package Description |
TFBGA, BGA153,14X14,20
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Clock Frequency-Max (fCLK) |
200 MHz
|
|
| Command User Interface |
YES
|
|
| Data Polling |
NO
|
|
| JESD-30 Code |
R-PBGA-B153
|
|
| Length |
13 mm
|
|
| Memory Density |
68719476736 bit
|
|
| Memory IC Type |
FLASH CARD
|
FLASH
|
| Memory Width |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
153
|
|
| Number of Words |
8589934592 words
|
|
| Number of Words Code |
8000000000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
8GX8
|
|
| Output Characteristics |
OPEN-DRAIN
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
VFBGA
|
|
| Package Equivalence Code |
BGA153,14X14,20
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
|
| Parallel/Serial |
PARALLEL
|
|
| Programming Voltage |
3.3 V
|
|
| Seated Height-Max |
1 mm
|
|
| Supply Current-Max |
0.045 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Toggle Bit |
NO
|
|
| Type |
MLC NAND TYPE
|
|
| Width |
11.5 mm
|
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
13 Weeks
|
|
|
|
Compare MX52LM08A11XVI with alternatives
Compare SDINBDG4-8G-XI with alternatives