MX29LV002NBTI-70G
vs
AM29LV102BB-70EI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MACRONIX INTERNATIONAL CO LTD
ADVANCED MICRO DEVICES INC
Part Package Code
TSOP1
TSOP
Package Description
TSOP1,
TSOP-32
Pin Count
32
32
Reach Compliance Code
unknown
unknown
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-PDSO-G32
R-PDSO-G32
JESD-609 Code
e6
Length
18.4 mm
18.4 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX8
256KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN BISMUTH
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
8 mm
8 mm
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8542.32.00.51
Compare MX29LV002NBTI-70G with alternatives
Compare AM29LV102BB-70EI with alternatives