MX29GL640EBTI-70G
vs
AM27C64-200DI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Contact Manufacturer
Ihs Manufacturer
MACRONIX INTERNATIONAL CO LTD
ROCHESTER ELECTRONICS LLC
Part Package Code
TSOP1
Package Description
TSOP-48
WINDOWED, CERAMIC, DIP-28
Pin Count
48
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.61
Factory Lead Time
12 Weeks
Samacsys Manufacturer
Macronix
Access Time-Max
70 ns
200 ns
Alternate Memory Width
8
Boot Block
BOTTOM
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PDSO-G48
R-CDIP-T28
JESD-609 Code
e3
Length
18.4 mm
Memory Density
67108864 bit
65536 bit
Memory IC Type
FLASH
UVPROM
Memory Width
16
8
Number of Functions
1
1
Number of Sectors/Size
8,127
Number of Terminals
48
28
Number of Words
4194304 words
8192 words
Number of Words Code
4000000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4MX16
8KX8
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
TSSOP
DIP
Package Equivalence Code
TSSOP48,.8,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Page Size
8/16 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.2 mm
Sector Size
8K,64K
Standby Current-Max
0.0001 A
Supply Current-Max
0.1 mA
0.025 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
4.5 V
Supply Voltage-Nom (Vsup)
3 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.5 mm
Terminal Position
DUAL
DUAL
Toggle Bit
YES
Type
NOR TYPE
Width
12 mm
Base Number Matches
1
2
Compare MX29GL640EBTI-70G with alternatives
Compare AM27C64-200DI with alternatives