MX28F160C3TXAC-90G vs MBM29DL163TE-90PBT feature comparison

MX28F160C3TXAC-90G Macronix International Co Ltd

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MBM29DL163TE-90PBT FUJITSU Semiconductor Limited

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MACRONIX INTERNATIONAL CO LTD FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code DSBGA BGA
Package Description TFBGA, PLASTIC, FBGA-48
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
Boot Block TOP TOP
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e1
Length 8 mm 8 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 6 mm 6 mm
Base Number Matches 1 1
Alternate Memory Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Temperature Grade INDUSTRIAL

Compare MX28F160C3TXAC-90G with alternatives

Compare MBM29DL163TE-90PBT with alternatives