MX27C8000MC-20
vs
GM23V8000AFW-30
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MACRONIX INTERNATIONAL CO LTD
|
LG SEMICON CO LTD
|
Part Package Code |
SOIC
|
|
Package Description |
SOP,
|
|
Pin Count |
32
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
200 ns
|
300 ns
|
JESD-30 Code |
R-PDSO-G32
|
R-PDSO-G32
|
JESD-609 Code |
e0
|
e0
|
Memory Density |
8388608 bit
|
8388608 bit
|
Memory IC Type |
OTP ROM
|
MASK ROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
|
Number of Terminals |
32
|
32
|
Number of Words |
1048576 words
|
1048576 words
|
Number of Words Code |
1000000
|
1000000
|
Operating Mode |
ASYNCHRONOUS
|
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
1MX8
|
1MX8
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Parallel/Serial |
PARALLEL
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.05 mm
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
11.3 mm
|
|
Base Number Matches |
1
|
3
|
Package Equivalence Code |
|
SOP32,.56
|
Standby Current-Max |
|
0.00005 A
|
Supply Current-Max |
|
0.03 mA
|
|
|
|
Compare MX27C8000MC-20 with alternatives