MX25L12855EXCI-10G vs W25Q128BVCCP feature comparison

MX25L12855EXCI-10G Macronix International Co Ltd

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W25Q128BVCCP Winbond Electronics Corp

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MACRONIX INTERNATIONAL CO LTD WINBOND ELECTRONICS CORP
Part Package Code BGA
Package Description TBGA, BGA24,4X6,40 ,
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature ALSO CONFIGURABLE AS 128M X 1, 20 YEAR DATA RETENTION
Alternate Memory Width 2
Clock Frequency-Max (fCLK) 104 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PBGA-B24
Length 8 mm
Memory Density 134217728 bit
Memory IC Type FLASH FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 16777216 words
Number of Words Code 16000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 16MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA24,4X6,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 2.7 V 3 V
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Serial Bus Type SPI
Standby Current-Max 0.00004 A
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Width 6 mm
Write Protection HARDWARE/SOFTWARE
Base Number Matches 1 1

Compare MX25L12855EXCI-10G with alternatives

Compare W25Q128BVCCP with alternatives