MX23C3211PC-12 vs KM23C32000C-12 feature comparison

MX23C3211PC-12 Macronix International Co Ltd

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KM23C32000C-12 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MACRONIX INTERNATIONAL CO LTD SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP42,.6
Pin Count 42 42
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 150 ns 120 ns
Additional Feature WITH PAGE MODE FUNCTION; PAGE MODE ACCESS TIME = 50NS
JESD-30 Code R-PDIP-T42 R-PDIP-T42
Length 52.07 mm 52.42 mm
Memory Density 4194304 bit 33554432 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 42 42
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX16 2MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.33 mm 5.08 mm
Supply Current-Max 0.05 mA 0.05 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP42,.6
Standby Current-Max 0.00005 A
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Terminal Finish TIN LEAD

Compare MX23C3211PC-12 with alternatives

Compare KM23C32000C-12 with alternatives