MX23C1010MC-10
vs
MX23C1010TC-10
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MACRONIX INTERNATIONAL CO LTD
|
MACRONIX INTERNATIONAL CO LTD
|
| Part Package Code |
SOIC
|
TSOP
|
| Package Description |
SOP, SOP32,.56
|
SOP, TSOP32,.8
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
100 ns
|
100 ns
|
| JESD-30 Code |
R-PDSO-G32
|
R-PDSO-G32
|
| JESD-609 Code |
e0
|
e0
|
| Length |
20.447 mm
|
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
MASK ROM
|
MASK ROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
128KX8
|
128KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP32,.56
|
TSOP32,.8
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.9972 mm
|
|
| Standby Current-Max |
0.0001 A
|
0.0001 A
|
| Supply Current-Max |
0.04 mA
|
0.04 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
11.303 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MX23C1010MC-10 with alternatives
Compare MX23C1010TC-10 with alternatives