MUR820HC0G
vs
BYW29-200
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
TAIWAN SEMICONDUCTOR CO LTD
|
PHILIPS SEMICONDUCTORS
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
|
Samacsys Manufacturer |
Taiwan Semiconductor
|
|
Additional Feature |
HIGH RELIABILITY
|
|
Application |
EFFICIENCY
|
|
Case Connection |
CATHODE
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
0.975 V
|
1.3 V
|
JEDEC-95 Code |
TO-220AC
|
|
JESD-30 Code |
R-PSFM-T2
|
|
JESD-609 Code |
e3
|
e0
|
Non-rep Pk Forward Current-Max |
100 A
|
100 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
|
Operating Temperature-Max |
175 °C
|
150 °C
|
Operating Temperature-Min |
-55 °C
|
|
Output Current-Max |
8 A
|
7.3 A
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
FLANGE MOUNT
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Reference Standard |
AEC-Q101
|
|
Rep Pk Reverse Voltage-Max |
200 V
|
200 V
|
Reverse Current-Max |
5 µA
|
|
Reverse Recovery Time-Max |
0.025 µs
|
0.025 µs
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
TIN
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Position |
SINGLE
|
|
Time@Peak Reflow Temperature-Max (s) |
10
|
|
Base Number Matches |
1
|
12
|
Rohs Code |
|
No
|
|
|
|
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