MTZJT-7710
vs
BZX79-C20,143
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ROHM CO LTD
NXP SEMICONDUCTORS
Package Description
ULTRA COMPACT, GLASS, MINI PACKAGE-2
HERMETIC SEALED, GLASS, SC-40, 2 PIN
Pin Count
2
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
HIGH RELIABILITY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LALF-W2
O-LALF-W2
Knee Impedance-Max
120 Ω
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
200 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Reference Voltage-Nom
10 V
20 V
Reverse Current-Max
0.2 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Working Test Current
5 mA
5 mA
Base Number Matches
1
2
Rohs Code
Yes
Part Package Code
AXIAL
Manufacturer Package Code
SOD27
Factory Lead Time
4 Weeks
Dynamic Impedance-Max
55 Ω
JEDEC-95 Code
DO-35
JESD-609 Code
e3
Moisture Sensitivity Level
1
Operating Temperature-Min
-65 °C
Peak Reflow Temperature (Cel)
260
Reference Standard
IEC-60134
Terminal Finish
TIN
Time@Peak Reflow Temperature-Max (s)
30
Voltage Tol-Max
5%
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