MTFC128GAPALPH-AAT
vs
MTFC128GAPALNS-AATTR
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Date Of Intro |
2020-03-31
|
|
Samacsys Manufacturer |
Micron
|
|
Base Number Matches |
1
|
1
|
Package Description |
|
,
|
Clock Frequency-Max (fCLK) |
|
200 MHz
|
Command User Interface |
|
YES
|
Data Polling |
|
NO
|
JESD-30 Code |
|
R-PBGA-B153
|
JESD-609 Code |
|
e1
|
Length |
|
13 mm
|
Memory Density |
|
1099511627776 bit
|
Memory IC Type |
|
Embedded MMC
|
Memory Width |
|
8
|
Number of Functions |
|
1
|
Number of Terminals |
|
153
|
Number of Words |
|
137438953472 words
|
Number of Words Code |
|
128000000000
|
Operating Mode |
|
SYNCHRONOUS
|
Operating Temperature-Max |
|
105 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
128GX8
|
Output Characteristics |
|
3-STATE
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
TFBGA
|
Package Equivalence Code |
|
BGA153,14X14,20
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Parallel/Serial |
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
|
260
|
Programming Voltage |
|
2.7 V
|
Ready/Busy |
|
YES
|
Seated Height-Max |
|
1.2 mm
|
Standby Current-Max |
|
0.00011 A
|
Supply Current-Max |
|
0.14 mA
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
2.7 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
0.5 mm
|
Terminal Position |
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Toggle Bit |
|
NO
|
Type |
|
NAND TYPE
|
Width |
|
11.5 mm
|
|
|
|
Compare MTFC128GAPALPH-AAT with alternatives
Compare MTFC128GAPALNS-AATTR with alternatives