MT9LSDT872HG-10EC1
vs
SM2M64SDT-6
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
ENHANCED MEMORY SYSTEMS INC
|
| Part Package Code |
MODULE
|
MODULE
|
| Package Description |
,
|
DIMM,
|
| Pin Count |
144
|
144
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.32
|
8542.32.00.02
|
| Access Mode |
FOUR BANK PAGE BURST
|
DUAL BANK PAGE BURST
|
| Access Time-Max |
6 ns
|
|
| Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
| JESD-30 Code |
R-XDMA-N144
|
R-XDMA-N144
|
| Memory Density |
603979776 bit
|
16777216 bit
|
| Memory IC Type |
SYNCHRONOUS DRAM MODULE
|
CACHE DRAM MODULE
|
| Memory Width |
72
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
144
|
144
|
| Number of Words |
8388608 words
|
2097152 words
|
| Number of Words Code |
8000000
|
2000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
8MX72
|
2MX8
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Self Refresh |
YES
|
YES
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Package Code |
|
DIMM
|
|
|
|
Compare MT9LSDT872HG-10EC1 with alternatives
Compare SM2M64SDT-6 with alternatives