MT9LSDT872HG-10EC1 vs HYM7V75A801BTZG-10S feature comparison

MT9LSDT872HG-10EC1 Micron Technology Inc

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HYM7V75A801BTZG-10S SK Hynix Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC SK HYNIX INC
Part Package Code MODULE MODULE
Package Description , DIMM, DIMM144,32
Pin Count 144 144
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 6 ns 6 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-XDMA-N144 R-XDMA-N144
Memory Density 603979776 bit 603979776 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
Memory Width 72 72
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8MX72 8MX72
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Self Refresh YES YES
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position DUAL DUAL
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 100 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Code DIMM
Package Equivalence Code DIMM144,32
Refresh Cycles 4096
Standby Current-Max 0.018 A
Supply Current-Max 1.62 mA
Terminal Pitch 0.8 mm

Compare MT9LSDT872HG-10EC1 with alternatives

Compare HYM7V75A801BTZG-10S with alternatives