MT9171AE
vs
MT8971BPR
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MITEL SEMICONDUCTOR
|
ZARLINK SEMICONDUCTOR INC
|
Part Package Code |
DIP
|
|
Package Description |
DIP, DIP22,.4
|
QCCJ,
|
Pin Count |
22
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Data Rate |
144 Mbps
|
|
ISDN Access Rate |
BASIC
|
|
JESD-30 Code |
R-PDIP-T22
|
S-PQCC-J28
|
JESD-609 Code |
e0
|
e0
|
Length |
27.555 mm
|
11.5062 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
22
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output High Voltage-Min |
2.4 V
|
|
Output Low Voltage-Max |
0.4 V
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
QCCJ
|
Package Equivalence Code |
DIP22,.4
|
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Point |
S
|
|
Seated Height-Max |
5.33 mm
|
4.57 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Telecom IC Type |
DIGITAL SLIC
|
DIGITAL SLIC
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
J BEND
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
10.16 mm
|
11.5062 mm
|
Base Number Matches |
2
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
|
|
|
Compare MT9171AE with alternatives
Compare MT8971BPR with alternatives