MT9076BP1
vs
T7230A--ML
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
BROADCOM INC
|
Package Description |
LEAD FREE, PLASTIC, MS-018AE, LCC-68
|
PLASTIC, LCC-68
|
Reach Compliance Code |
compliant
|
compliant
|
Samacsys Manufacturer |
Microchip
|
|
Carrier Type |
CEPT PCM-30/E-1
|
|
Carrier Type (2) |
T-1(DS1)
|
|
JESD-30 Code |
S-PQCC-J68
|
S-PQCC-J68
|
JESD-609 Code |
e3
|
e0
|
Length |
24.23 mm
|
24.2316 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
68
|
68
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC68,1.0SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
5.08 mm
|
Supply Current-Max |
98 mA
|
|
Supply Voltage-Nom |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24.23 mm
|
24.2316 mm
|
Base Number Matches |
3
|
3
|
HTS Code |
|
8542.39.00.01
|
Peak Reflow Temperature (Cel) |
|
225
|
Technology |
|
CMOS
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MT9076BP1 with alternatives
Compare T7230A--ML with alternatives