MT9072AV
vs
MT9072AV2
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ZARLINK SEMICONDUCTOR INC
|
MICROSEMI CORP
|
Package Description |
17 X 17 MM, 1.30 MM HEIGHT, PLASTIC, MO-192, LBGA-220
|
17 X 17 MM, 1.30 MM HEIGHT, LEAD FREE, PLASTIC, MO-192, LBGA-220
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B220
|
S-PBGA-B220
|
JESD-609 Code |
e0
|
e1
|
Length |
17 mm
|
17 mm
|
Number of Functions |
8
|
8
|
Number of Terminals |
220
|
220
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA220,16X16,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
225
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.5 mm
|
1.5 mm
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
220
|
|
|
|
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