MT9072AV2
vs
DS34T101GN+
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
17 X 17 MM, 1.30 MM HEIGHT, LEAD FREE, PLASTIC, MO-192, LBGA-220
|
BGA, BGA484,22X22,40
|
Pin Count |
220
|
484
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B220
|
S-PBGA-B484
|
JESD-609 Code |
e1
|
e1
|
Length |
17 mm
|
23 mm
|
Number of Functions |
8
|
1
|
Number of Terminals |
220
|
484
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.5 mm
|
2.41 mm
|
Supply Voltage-Nom |
3.3 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
23 mm
|
Base Number Matches |
2
|
1
|
ECCN Code |
|
EAR99
|
Moisture Sensitivity Level |
|
3
|
Package Equivalence Code |
|
BGA484,22X22,40
|
Peak Reflow Temperature (Cel) |
|
260
|
Supply Current-Max |
|
115 mA
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MT9072AV2 with alternatives
Compare DS34T101GN+ with alternatives