MT89L80ANR vs MT89L85AP feature comparison

MT89L80ANR Zarlink Semiconductor Inc

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MT89L85AP Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC MICROSEMI CORP
Package Description SSOP,
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G48 S-PQCC-J44
JESD-609 Code e0
Length 15.88 mm
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 48 44
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP QCCJ
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, SHRINK PITCH CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.79 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Telecom IC Type DIGITAL TIME SWITCH
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING J BEND
Terminal Pitch 0.635 mm 1.27 mm
Terminal Position DUAL QUAD
Width 7.49 mm
Base Number Matches 2 2
Pbfree Code No
Part Package Code LPCC
Pin Count 44
Package Equivalence Code LDCC44,.7SQ
Supply Current-Max 7 mA

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