MT8979AP vs MT8977APR feature comparison

MT8979AP Microsemi Corporation

Buy Now Datasheet

MT8977APR Zarlink Semiconductor Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP ZARLINK SEMICONDUCTOR INC
Part Package Code LPCC
Pin Count 44
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQCC-J44 S-PQCC-J44
Number of Functions 1 1
Number of Terminals 44 44
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC44,.7SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Supply Current-Max 16 mA 10 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Telecom IC Type FRAMER FRAMER
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Base Number Matches 2 3
Package Description PLASTIC, MS-018AC, LCC-44
JESD-609 Code e0
Length 16.585 mm
Moisture Sensitivity Level 1
Seated Height-Max 4.57 mm
Terminal Finish TIN LEAD
Width 16.585 mm

Compare MT8977APR with alternatives