MT8977APR vs MT8979AP1 feature comparison

MT8977APR Rochester Electronics LLC

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MT8979AP1 Zarlink Semiconductor Inc

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC ZARLINK SEMICONDUCTOR INC
Part Package Code LPCC
Package Description PLASTIC, MS-018AC, LCC-44 LEAD FREE, PLASTIC, MS-018AC, LCC-44
Pin Count 44
Reach Compliance Code unknown compliant
JESD-30 Code S-PQCC-J44 S-PQCC-J44
JESD-609 Code e0 e3
Length 16.585 mm 16.585 mm
Moisture Sensitivity Level 1 3
Number of Functions 1 1
Number of Terminals 44 44
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 225 260
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 4.57 mm 4.57 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Telecom IC Type FRAMER FRAMER
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 16.585 mm 16.585 mm
Base Number Matches 3 2
HTS Code 8542.39.00.01
Supply Current-Max 16 mA