MT8977AP vs MT8976AP feature comparison

MT8977AP Microsemi Corporation

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MT8976AP Zarlink Semiconductor Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MITEL SEMICONDUCTOR ZARLINK SEMICONDUCTOR INC
Part Package Code LPCC
Pin Count 44
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQCC-J44 S-PQCC-J44
JESD-609 Code e0 e0
Number of Functions 1 1
Number of Terminals 44 44
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC44,.7SQ LDCC44,.7SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Supply Current-Max 10 mA 10 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Telecom IC Type FRAMER FRAMER
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Base Number Matches 4 4
Package Description QCCJ, LDCC44,.7SQ
Length 16.585 mm
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Seated Height-Max 4.57 mm
Width 16.585 mm

Compare MT8977AP with alternatives

Compare MT8976AP with alternatives