MT8976AP vs MT8979AP1 feature comparison

MT8976AP Zarlink Semiconductor Inc

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MT8979AP1 Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC MICROSEMI CORP
Package Description QCCJ, LDCC44,.7SQ LEAD FREE, PLASTIC, MS-018AC, LCC-44
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQCC-J44 S-PQCC-J44
JESD-609 Code e0 e3
Length 16.585 mm 16.585 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 44 44
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC44,.7SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.57 mm
Supply Current-Max 10 mA 16 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Telecom IC Type FRAMER FRAMER
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 16.585 mm 16.585 mm
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code LPCC
Pin Count 44

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Compare MT8979AP1 with alternatives