MT72JSZS2G72PZ-1G0XX vs M392B2G73AM0-CH9 feature comparison

MT72JSZS2G72PZ-1G0XX Micron Technology Inc

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M392B2G73AM0-CH9 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC SAMSUNG SEMICONDUCTOR INC
Part Package Code DIMM DIMM
Package Description DIMM, DIMM, DIMM240,40
Pin Count 240 240
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode FOUR BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-XDMA-N240 R-XDMA-N240
Memory Density 154618822656 bit 154618822656 bit
Memory IC Type DDR DRAM MODULE DDR3 DRAM MODULE
Memory Width 72 72
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 240 240
Number of Words 2147483648 words 2147483648 words
Number of Words Code 2000000000 2000000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 95 °C
Operating Temperature-Min
Organization 2GX72 2GX72
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.575 V 1.575 V
Supply Voltage-Min (Vsup) 1.425 V 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V 1.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Form NO LEAD NO LEAD
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code Yes
Access Time-Max 0.255 ns
Clock Frequency-Max (fCLK) 667 MHz
I/O Type COMMON
Length 133.35 mm
Output Characteristics 3-STATE
Package Equivalence Code DIMM240,40
Peak Reflow Temperature (Cel) 260
Refresh Cycles 8192
Seated Height-Max 18.9 mm
Supply Current-Max 3.23 mA
Terminal Pitch 1 mm

Compare MT72JSZS2G72PZ-1G0XX with alternatives

Compare M392B2G73AM0-CH9 with alternatives