MT5C1008C-25 vs P4C1024L-25C4M feature comparison

MT5C1008C-25 Micron Technology Inc

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P4C1024L-25C4M Pyramid Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICRON TECHNOLOGY INC PYRAMID SEMICONDUCTOR CORP
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
I/O Type COMMON COMMON
JESD-30 Code R-XDIP-T32 R-CDIP-T32
JESD-609 Code e0 e0
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP32,.4 DIP32,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.007 A 0.017 A
Standby Voltage-Min 4.5 V 2 V
Supply Current-Max 0.12 mA 0.105 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Part Package Code DIP
Package Description DIP,
Pin Count 32
Additional Feature LG-MAX
Length 43.18 mm
Number of Functions 1
Number of Ports 1
Output Enable YES
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.8928 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.16 mm

Compare MT5C1008C-25 with alternatives

Compare P4C1024L-25C4M with alternatives