MT58V2MV18FF-7.5
vs
K7N401801A-TC160
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
QFP
Package Description
TBGA,
LQFP,
Pin Count
165
100
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
7.5 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE
JESD-30 Code
R-PBGA-B165
JESD-609 Code
e1
Length
17 mm
Memory Density
37748736 bit
Memory IC Type
STANDARD SRAM
Memory Width
18
Number of Functions
1
Number of Terminals
165
Number of Words
2097152 words
Number of Words Code
2000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
2MX18
Package Body Material
PLASTIC/EPOXY
Package Code
TBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
15 mm
Base Number Matches
2
1
Compare MT58V2MV18FF-7.5 with alternatives
Compare K7N401801A-TC160 with alternatives