MT58V2MV18FF-7.5
vs
CY7C1305BV18-133BZC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
TBGA,
13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165
Pin Count
165
165
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
7.5 ns
3 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e1
e0
Length
17 mm
15 mm
Memory Density
37748736 bit
18874368 bit
Memory IC Type
STANDARD SRAM
QDR SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
2097152 words
1048576 words
Number of Words Code
2000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX18
1MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.4 mm
Supply Voltage-Max (Vsup)
2.625 V
1.9 V
Supply Voltage-Min (Vsup)
2.375 V
1.7 V
Supply Voltage-Nom (Vsup)
2.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
15 mm
13 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
220
Compare MT58V2MV18FF-7.5 with alternatives
Compare CY7C1305BV18-133BZC with alternatives