MT58V2MV18FF-7.5
vs
IS61VPS10018-166TQ
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
QFP
Package Description
TBGA,
TQFP-100
Pin Count
165
100
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
7.5 ns
3.5 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE
JESD-30 Code
R-PBGA-B165
R-PQFP-G100
JESD-609 Code
e1
e0
Length
17 mm
20 mm
Memory Density
37748736 bit
18874368 bit
Memory IC Type
STANDARD SRAM
CACHE SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
165
100
Number of Words
2097152 words
1048576 words
Number of Words Code
2000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX18
1MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
LQFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.6 mm
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Width
15 mm
14 mm
Base Number Matches
2
2
Pbfree Code
Rohs Code
Compare MT58V2MV18FF-7.5 with alternatives
Compare IS61VPS10018-166TQ with alternatives